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FCI NXT™ Plating System for Use on Printed Circuit Boards

IP.com Disclosure Number: IPCOM000010722D
Publication Date: 2003-Jan-15
Document File: 2 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses the FCI USA Inc. proprietary plating system (NXT™) for plating gold finger connector areas to PCBs. Benefits include cost reductions due to less gold placed on the PCB.

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FCI NXT™ Plating System for Use on Printed Circuit Boards

Disclosed is a method that uses the FCI USA Inc. proprietary plating system (NXT™) for plating gold finger connector areas to PCBs. Benefits include cost reductions due to less gold placed on the PCB.

Background

Currently, processes for gold finger thickness on PCBs are limited to a minimum of 20 micro-inches.

General Description

The NXT™ plating system consists of flash gold over amorphous nickel (AmNi) plating. The proprietary process utilizes special chemistry and equipment. FCI is the developer and owner of a proprietary process for electroplating electrical contacts with an amorphous nickel alloy, now sold under the trade name NXT™. Significant technical know how and process knowledge has been developed over the period of several years for utilization of the technology in high speed, reel to reel applications, for interconnector products. It has not been used for PCB plating which is a rack or tab environment. (See Figure 1)

Advantages

Some implementations of the disclosed structure and method provide one or more of the following advantages:

The disclosed method reduces costs by placing less gold on PCBs.

Fig. 1

Disclosed anonymously