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Die/Substrate Interconnect Mechanism Using Tip-to-Plateau Metal Contact and Fusion

IP.com Disclosure Number: IPCOM000010740D
Publication Date: 2003-Jan-15
Document File: 2 page(s) / 102K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a new method for attaching dice on substrate, which uses the concept of tip-to-plateau metal contact and fusion. Benefits include increasing joint strength and reliability, and reducing the occurrence of non-wet issues.

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Die/Substrate Interconnect Mechanism Using Tip-to-Plateau Metal Contact and Fusion

Disclosed is a new method for attaching dice on substrate, which uses the concept of tip-to-plateau metal contact and fusion. Benefits include increasing joint strength and reliability, and reducing the occurrence of non-wet issues.

Background

Currently, dice are attached to substrate using the tip-to-tip metal contact and fusion method (see Figure 1).

Non-wetting between two metals, at a high percentage, causes the problem of discontinuity at the metal-to-metal interface. This results in electrical discontinuity during testing. The issue of non-wet has been encountered on almost every flip chip platform, with impacts varying from minor yield losses to high volume manufacturing “show-stoppers”.

Also, slippage normally occurs when two pointed entities come in contact with one another vertically. Slippage, if occurring frequently, can cause die misalignment which results in test failures (i.e. electrical discontinuity if there is no proper contact between die and substrate bumps, or electrical shorting if adjacent bumps that should not come into contact touch each other).

General Description

The disclosed method uses a new tip-to-plateau metal contact and fusion process for attaching dice on a substrate

During the reflow process after die placement, the disclosed method allows an almost complete immersion of the die column into the pool of molten substrate solder (see Figure 2). This immersi...