Browse Prior Art Database

Method for a multi-fold BGA package

IP.com Disclosure Number: IPCOM000010885D
Publication Date: 2003-Jan-29
Document File: 2 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a multi-fold ball-grid array (BGA) package. Benefits include improved functionality, improved productivity, and improved ease of manufacturing.

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Method for a multi-fold BGA package

Disclosed is a method for a multi-fold ball-grid array (BGA) package. Benefits include improved functionality, improved productivity, and improved ease of manufacturing.

Background

        � � � � � Conventionally, the capability to stack dice on top of each other is limited. During assembly, units are required to go back and forth from the die attach step to the wire bond step until the top-most die is attached. This procedure involves long assembly through-put time and the repeated handling of units, which poses significant risk of damage.

General description

        � � � � � The disclosed method is a multi-stacking packaging technique that offers improved die stacking capability. The key elements of the method include:

•        � � � � Dice and solder-pad array that are laid out so that unlimited die stacking is made possible

•        � � � � Electrical continuity from the die to the solder spheres through centralized wire layout technique or direct die-to-substrate interconnection methods

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to unlimited die stacking capability with a simple assembly process requirement

•        � � � � Improved productivity due to short assembly through-put time

•        � � � � Improved ease of manufacturing due to all devices being attached on the tape substrate prior wire bonding

•        � � � � Improved ease of manufacturing due to utilizing dispense encapsulation instead of tr...