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Method for material flow stress relief features for an imprinting microtool

IP.com Disclosure Number: IPCOM000010886D
Publication Date: 2003-Jan-29
Document File: 3 page(s) / 48K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for material flow stress relief features for an imprinting microtool. Benefits include improved functionality and improved reliability.

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Method for material flow stress relief features for an imprinting microtool

Disclosed is a method for material flow stress relief features for an imprinting microtool. Benefits include improved functionality and improved reliability.

Background

        � � � � � The accumulation of unwanted material in regions with a high density of imprinted features leads to poor quality features and accumulates stresses. Material accumulation may cause material damage, such as cohesive failures and delamination of thin film from the metal core, and may adversely affect further processes downstream.

        � � � � � The volume of the material displaced during imprinting must be accounted for. If not done, the displaced material is forced into any immediately accessible free volume that is present at the top surface of the work piece. The displaced material forms irregular protrusions on the surface, against which the imprinting tool must push. Some of the material, which is intended to be displaced, cannot be displaced. The result is thick chads. Moreover, the stress, created during imprinting process creates cracks in the work piece.

        � � � � � Conventionally, no provision is made for the volume of the displaced material. The surface irregularities and chads are removed by lengthy plasma etching and planarization processes. No solution exists for the deformation and cracking.

General description

� � � � � The disclosed method creates cavities in the imprinting microtool for plastically displaced excess polymer material to fill. The displaced excess material is removed after imprinting is complete.

        � � � � � During the pla...