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Method of Electromagnetic Interference Suppression for IHS Packaging

IP.com Disclosure Number: IPCOM000010966D
Publication Date: 2003-Feb-05
Document File: 2 page(s) / 66K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses the IHS heat slug as a common ground plane to suppress electromagnetic interference (EMI). The heat slug is connected to the Vcc planes in the substrate and uses a conductive solder paste. Benefits include an improvement in overall package performance.

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Method of Electromagnetic Interference Suppression for IHS Packaging

Disclosed is a method that uses the IHS heat slug as a common ground plane to suppress electromagnetic interference (EMI). The heat slug is connected to the Vcc planes in the substrate and uses a conductive solder paste. Benefits include an improvement in overall package performance.

Background

EMI is responsible for degrading or limiting the performance of the package. Currently, state of the art technology uses a variety of grounding techniques, as well as filters, to reduce EMI.

General Description

The disclosed method uses the die and passive devices inside the IHS lid. The lid is attached to a metal surface on the substrate, using solder paste and a paste print/reflow SMT process. The metal surface is connected to the inner layers of the substrate ground using vias to connect to the ground ring (see Figures 1 and 2). The end result is a substantial reduction and shielding of package EMI, resulting in higher performance

Advantages

The die, as well as the passive components, are placed under a grounded IHS lid, which effectively creates an EMI/RFI shield. The backside of the die faces the grounded heat slug, which is grounded to the various Vcc layers within the package. Overall, the ground loop noise is reduced and the package performance is improved.

Fig. 1

Fig. 2

Disclosed anonymously