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Methods for Making Electrical Connections From Two Bonding Planes With a Large Angle

IP.com Disclosure Number: IPCOM000010971D
Publication Date: 2003-Feb-05
Document File: 3 page(s) / 290K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that redistributes electrical signals from two bonding planes with a large angle by introducing an intermediate carrier. Benefits include improved process and handling.

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Methods for Making Electrical Connections From Two Bonding Planes With a Large Angle

Disclosed is a method that redistributes electrical signals from two bonding planes with a large angle by introducing an intermediate carrier. Benefits include improved process and handling.

Background

Currently, active optics are typically attached directly to substrates. Most existing active optics are relatively simple and require less constraints. The disclosed method deals with complicated active optics.

General Description

The following steps describe how the disclosed method works:

 

  1. The active optical parts are vertical. A light beam goes through the optical axis with a near 90 ° angle (see Figure 1).
  2. The carrier holds the optical parts near vertical. Electrical connections from the optics to carrier are either made by wire bonding or by a flip chip (see Figure 2).
  3. The substrate or sled is horizontal. Electrical circuits route on the substrate (see Figure 3).
  4. Electrical signal connections from the carrier to the substrate are made with flying wires, corner bumping, wire bonding, or soldering.
  5. The assembly has sufficient thermal conductivity and mechanical strength. 

Note. The carrier can be made by machining, molding, brazing, plating, etc., thin or thick film operations.

Advantages

The disclosed method deals with complicated active optics, and has the following advantages:

  • Optics are attached to the carrier. This carrier incorporates appropriate anti-reflection angles, and redistribu...