Browse Prior Art Database

Substrate Mounting to Top-Side Silicon and Package Over Mold on Wire-Bond Packages to Facilitate Package Stacking

IP.com Disclosure Number: IPCOM000011425D
Publication Date: 2003-Feb-19
Document File: 2 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that adheres a substrate to the top side of the silicon and over molds the package, in order to improve package stacking. Benefits include a lower total cost solution with increase package reliability.

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Substrate Mounting to Top-Side Silicon and Package Over Mold on Wire-Bond Packages to Facilitate Package Stacking

Disclosed is a method that adheres a substrate to the top side of the silicon and over molds the package, in order to improve package stacking. Benefits include a lower total cost solution with increase package reliability.

Background

Currently, all die (including logic) are stacked in a single package using existing stacked packaging technology (see Figure 1); however, this tends to waste good dies when one bad die exists in the stack up.

The current state of the art design uses the interconnect method between the top package and lower package. Current design requires use of an interposer to make the interconnect. This interposer adds additional costs, and adds extra manufacturing and assembly steps to build a stacked package in this format.

General Description

The disclosed method uses conventional HVM technology to assemble the lower package, and attach silicon to the die. Next, the single metal layer substrate with an existing backside adhesive is picked and placed on the surface of the first silicon. The package is then cured and wire bonded (see Figure 2). The molding is then done in such a way as to leave the top side of the substrate exposed (see Figure 3). The package is then singulated and tested using conventional processes. The top package (already tested) is stacked and re-flowed to the bottom package.

Advantages

The disclosed method offers a lower t...