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Method for an IHS for directly loaded socket attachment to a substrate

IP.com Disclosure Number: IPCOM000011429D
Publication Date: 2003-Feb-19
Document File: 4 page(s) / 110K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method and design for an integrated heat spreader (IHS)combined socket attachment to directly load one component to a substrate. Benefits include improved thermal interface material interface performance, improved package reliability, and an improved simplified package assembly design.

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Method for an IHS for directly loaded socket attachment to a substrate

Disclosed is a method and design for an integrated heat spreader (IHS)combined socket attachment to directly load one component� to a substrate. Benefits include improved thermal interface material interface performance, improved package reliability, and an improved simplified package assembly design.

Background

� � � � � Conventional socket-attach designs require a plate that has a hinge, load lever, and an opening for the IHS (see Figure 1). The plate attaches to the substrate frame (see Figure 2), maintaining pressure on the socket and attaching it to the substrate (see Figure 3).

General description

        � � � � � The disclosed method is an IHS with latching and load features to attach it to a substrate frame. The IHS directly attaches to the die, substrate, and socket with out the use of sealant. The disclosed method reduces the number of components for a socket attachment from two to one. The IHS can be redesigned with down-set features if solder or sealant attachment closer to the die is required to reduce warpage strain on the thermal interface material (TIM).

        � � � � � The key elements of the method include:

•        � � � � Ni plated Cu heat spreader with hinge and load lever features

•        � � � � Substrate frame

•        � � � � Substrate with die attached

•        � � � � Solder, polymer, polymer/solder hybrid TIM

•        � � � � Load lever

•        � � � � Socket

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � �...