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Method for matching the Dks of the laminate’s woven material with the fill material to reduce the Dk variation

IP.com Disclosure Number: IPCOM000011430D
Publication Date: 2003-Feb-19
Document File: 1 page(s) / 24K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to reduce the Dk variation by matching the dielectric constants (Dks) of the laminate’s woven material with the fill material. Benefits include improved performance.

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Method for matching the Dks of the laminate’s woven material with the fill material to reduce the Dk variation

Disclosed is a method to reduce the Dk variation by matching the dielectric constants (Dks) of the laminate’s woven material with the fill material. Benefits include improved performance.

Background

        � � � � � Conventionally, when the Dk of the laminate’s woven material is different from the Dk of the fill material used to impregnate the woven material, signal’s integrity is degraded. The problem occurs as the signal trace crosses over the glass bundles of the woven material and the spaces between the glass bundles, which are filled with resin. This problem is conventionally solved by specifying higher impedance tolerances to accommodate the higher Dk variance, which reduces electrical performance.

Description

        � � � � � The disclosed method matches the Dk of the woven material (glass) with the Dk of the fill material (resin) prior to producing the laminate. The signal integrity is improved.

        � � � � � During the fabrication of the printed circuit board laminates, the laminate manufacturer selects a woven material with a Dk that matches or comes close to matching the Dk of the fill material. The signal passing over the laminate experiences lower variation in the Dk due to the matching.

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved performance due to the improved signal quality because of the matching of the Dks o...