Browse Prior Art Database

Method for an interconnect adaptor card

IP.com Disclosure Number: IPCOM000011512D
Publication Date: 2003-Feb-26
Document File: 4 page(s) / 148K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an interconnect adaptor card (IAC). Benefits include improved functionality, improved performance, improved power performance, and improved design flexibility.

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Method for an interconnect adaptor card

Disclosed is a method for an interconnect adaptor card (IAC). Benefits include improved functionality, improved performance, improved power performance, and improved design flexibility.

Background

        � � � � � Multiple printed circuit board (PCB) systems require the alignment and connection of the boards into a multiple backplane slots. The boards must gain access to additional power sources and input/output (I/O) connections. Additional functions, such as security and bus bridging) must be available for the boards/board systems.

        � � � � � Conventionally, systems may include a main board and one or more daughter cards/boards interconnected by board-to-board connectors. The daughter cards do not connect to the backplane because alignment is too difficult during insertion (see Figure 1). Inadequate interconnection schemes highlight the related problems of insufficient electrical power or I/O bandwidth to/from the backplane. For example, not enough electrical power and I/O bandwidth may be provided to a multiple board configuration that cannot adequately connect to multiple back-plane slots. The main board/daughter board(s) system is limited to only the available power and I/O from one slot. With a trend toward higher density connectors, this interconnection problem is becoming an increasing challenge.

General description

� � � � � The disclosed method is an IAC. It is a PCB board that enables multiple cards/boards to interconnect together and connect to multiple slot connectors in a standard backplane without alignment problems. The IAC also enables for added functionality among the multiple cards interconnected together as described in the key feature elements below.

        � � � � � The key elements of the method include:

•        � � � � Multiple interconnected boards that connect into the slot connectors of a standard backplane

•        � � � � Interconnection of the main board and multiple daughter boards

•        � � � � Connection of a daughter board to the backplane

•        � � � � Power supply for the multiple board system by multiple slots in the standard backplane

•        � � � � Backplane I/O access for the multiple board system by connections to multiple backplane slots

•        � � � � Additional function support, including:

        � � � � � -        � � � � Security chip

        � � � � � -        � � � � Advanced switching gasket chip

        � � � � � -        � � � � Board-to-board routing flexibility, depending on the application

Advantages

        � � � � � The disclosed method provides advantages, i...