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Method for a hexagonal heatsink fin

IP.com Disclosure Number: IPCOM000011514D
Publication Date: 2003-Feb-26
Document File: 4 page(s) / 300K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a hexagonal heatsink fin. Benefits include improved thermal performance.

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Method for a hexagonal heatsink fin

Disclosed is a method for a hexagonal heatsink fin. Benefits include improved thermal performance.

Background

        � � � � � Conventional heatsink technologies (such as with parallel plates and pin fins) have reached a performance limit in air-cooling applications. The typical methods to further improve their thermal performance are to increase the velocity of the cooling air and to increase the fin surface area.

        � � � � � Increasing the fin surface area requires that the total heatsink volume be increased or that the density of fins in a fixed volume be increased. The first approach is acceptable only if more volume is available, which is unlikely in computing applications. The second approach is limited by manufacturing methods and airflow performance. As the density of fins increases in a given heatsink volume, the pressure drop across the heatsink increases, which results in decreased airflow velocity and overall heatsink thermal performance.

Description

        � � � � � The disclosed method is a hexagonal heatsink fin made of a thermally conductive material for a parallel-flow air heatsink (heat exchanger). Hexagonal fins increase the surface area available for heat transfer via forced convection, improving thermal performance as compared to conventional parallel plate heatsinks.

        � � � � � The key elements of the method include:

•        � � � � Array of hexagonal fins (see Figures 1 and 2)

•        � � � � Attachment of the fins to a base constructed out...