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Method for a heatsink with an integrated TEC and a tapered base

IP.com Disclosure Number: IPCOM000011515D
Publication Date: 2003-Feb-26
Document File: 3 page(s) / 58K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink with an integrated thermoelectric cooler (TEC) and a tapered base. Benefits include improved thermal performance, improved functionality, and improved reliability.

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Method for a heatsink with an integrated TEC and a tapered base

Disclosed is a method for a heatsink with an integrated thermoelectric cooler (TEC) and a tapered base. Benefits include improved thermal performance, improved functionality, and improved reliability.

Background

        � � � � � Conventional heatsink technologies have approached a limit in their capability to cool some high heat generating processors in confined spaces. Improved thermal performance is required.

General description

        � � � � � The disclosed method is a heatsink with a TEC and a tapered base. The increased thermal performance can cool processors in confined space computing systems.

        � � � � � The disclosed method integrates a thermoelectric cooler into a heatsink base. It is tapered in a pyramoid shape to reduce the amount of base material. The thermoelectric cooler pumps heat out from a heat source (such as a processor). The heatsink removes the heat from the TEC to the surrounding air via conduction and convection.

        � � � � � The key elements of the method include:

•        � � � � Thermoelectric cooler (TEC) integrated into the heatsink base

•        � � � � Controlled thermal contact between the base and TEC because it is integrated into the heatsink base

•        � � � � Pyramoid base shape that spreads the heat to the fin array

•        � � � � Integration of the TEC into the base for an improved thermal solution compared to others of equivalent overall heights

•        � � � � Tapered fin base that minimizes the amount of base material, which results in a...