Browse Prior Art Database

Foam from the Back Retention for Bare Die Applications

IP.com Disclosure Number: IPCOM000011726D
Publication Date: 2003-Mar-12
Document File: 4 page(s) / 280K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a distributed load for heat sink retention and the bond line control of thermal interface materials (TIM) on a bare die. Benefits include an improvement in thermal performance.

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Foam from the Back Retention for Bare Die Applications

Disclosed is a method that uses a distributed load for heat sink retention and the bond line control of thermal interface materials (TIM) on a bare die. Benefits include an improvement in thermal performance.

Background

Currently, bare die technology uses a clip and four pins to hold the heat sink in place at the back of the motherboard (see Figure 1). The bare die performance of� TIMs are extremely poor due to various issues such as poor BLT control, large piece part variability, and a tilt in thermal solution.

General Description

The schematic of the disclosed method is shown in Figure 2. The package is seated into the socket by way of the signal pins on the bottom of the package. The socket mechanism is actuated in order to grasp the package’s signal pins. At this point, the socket has previously been surface-mounted to the test board. The board receives power from an external source through the edge-connection power signal. The socket supports the package and allows the package to communicate with the test board.

The next subassembly involves items 2, 3, 6, 7 and 9 in Figure 3. The standoffs (2) are attached to the pressure plate (3) with the flat-head screws (7).� The set screws and nuts are then attached to the pressure plate’s corners to limit the amount of tilting that occurs when the plate is pulled against the die. Items 4, 5 and 8 are then attached to the previous subassembly against the back of the test board by...