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Method for cooling a series of heat generating devices

IP.com Disclosure Number: IPCOM000011731D
Publication Date: 2003-Mar-12
Document File: 5 page(s) / 189K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for cooling a series of heat generating devices. Benefits include improved functionality, improved performance, improved ease of manufacturing, improved reliability, and improved support for legacy devices.

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Method for cooling a series of heat generating devices

Disclosed is a method for cooling a series of heat generating devices. Benefits include improved functionality, improved performance, improved ease of manufacturing, improved reliability, and improved support for legacy devices.

Background

        � � � � � The disclosed method addresses the problem of forced air convection cooling a series of heat sensitive components (see Figure 1). The prior components in the air stream heat the air used to cool the latter components, causing them to have a higher incidence of thermal related failure.

        � � � � � The types of heat sensitive components may include a variety of electronic components, such as processors, chipsets, memory, and a variety of input/output (I/O) components.

        � � � � � No conventional solution to this problem exists using forced-air convection cooling. Conventional solutions use more exotic and costly methods, such as liquid cooling.

        � � � � � Duct head loss is a pressure drop that is measured by a column of liquid.

General description

        � � � � � The disclosed method cools a series of heat generating devices. Cool air is delivered to the heat generating devices in an electronic assembly, while removing hotter air. Ambient inlet air is divided into multiple air streams and delivered as a near-ambient temperature air stream to a series of heat generating devices through a duct. Heated air from prior heat generating devices is exhausted without affecting the latter heat generating devices. The disclosed method more effectively cools the latter devices in the series.

        � � � � � The key elements of the method include:

•        � � � � Averaging and distribution of the thermal load across a plurality of heat generating devices

•        � � � � Configurable heat spreaders with features that can increase the surface area, such as corrugated sheet and fins

•        � � � � Forced air convection, which is more cost effective than liquid cooling

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to improved forced air convection cooling multiple heat generating devices in series

•        � � � � Improved performance due to providing near ambient inlet air stream temperature to multiple heat generating devices in a series

•        � � � � Improved performance due to preventing cumulative heating by preceding heat generating devices

•        � � � � Improved ease of manufacturing due to the simplicity of the baffle system

•        � � � � Improved reliability due to improving the mean time between failure (MTBF) for any of the devices involved

•        � � � � Improved support for legacy devices due to reducing thermal failure for electronic assemblies that produce heat

•        � � � � Improved cost effectiveness due to maximizing the low-cost forced-air cooling approach

Detailed description

        � � � � � The disclosed method cools a series of heat generating devices. A duct system removes excess heat from the air stream and delivers ambie...