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Method for cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects

IP.com Disclosure Number: IPCOM000011743D
Publication Date: 2003-Mar-12
Document File: 4 page(s) / 173K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects. Benefits include an improved test environment and improved throughput.

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Method for cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects

Disclosed is a method for cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects. Benefits include an improved test environment and improved throughput.

Background

              Package solder joints must be tested for mechanical integrity under various fatigue loads that are representative of field-use conditions. Fatigue-life curves must be developed that can be used for system designs to ensure solder robustness throughout the conditions during a product’s lifetime.

              Individual-unit testing on single boards at single stress levels is considered typical of the industry norm. Very little flexibility is allowed for various loads. Conventional testing is exhaustive and time consuming.

General description

              The disclosed method is a cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects. The method quantifies the mechanical reliability of the solder-joint interconnects of microelectronic packages. Board-mounted packages are subjected to cyclic, flexure-induced stresses at varying levels with an in-placemethod of monitoring electrical connectivity. The entire test method is flexible enough to handle many units and stress levels simultaneously in one test run. A generous amount of data can be collected very quickly with full characterization of the mechanical robustness achieved in a minimum amount of testing time.

              The key elements of the method include:

•             Three-point or four-point bend test fixture that can be mounted to any standard mechanical testing machine

•             Electrical monitoring apparatus that continuously monitors and records electrical functionality of the package through the solder joints

•             Special test boards that contain traces that route through the packages and their corner solder joints and can test many units simultaneously

Advantages

              The disclosed method provides advantages, including:

•             Improved test environment due to testing multiple units simultaneously at several stress levels

•             Improved throughput due to creating an entire S/N curve with minimal resource consumption

Detailed description

              The disclosed method is a cyclic three- and four-point bend test for the mechanical reliability of so...