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Method for a die-attach process in semiconductor packaging to eliminate non-wet interconnections

IP.com Disclosure Number: IPCOM000011836D
Publication Date: 2003-Mar-19
Document File: 3 page(s) / 72K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a die-attach process in semiconductor packaging to eliminate non-wet interconnections. Benefits include improved performance and improved ease of manufacturing.

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Method for a die-attach process in semiconductor packaging to eliminate non-wet interconnections

Disclosed is a method for a die-attach process in semiconductor packaging to eliminate non-wet interconnections. Benefits include improved performance and improved ease of manufacturing.

Background

              A requirement exists to eliminate non- wet die-to-substrate chip attachment solder interconnection. Conventionally, non-wet interconnections are prevented by the following solutions:

•             Optimizing the flux formulation for more efficient oxide removal

•             Optimizing flux thickness on substrates

•             Optimizing the substrate solder bump surface characteristics

      Conventional process technology requires solder to reach a lower viscosity to facilitate the wick-up process, which occurs at temperatures much higher than the solder melting point.

General description

      The disclosed method is a die-attach process in semiconductor packaging that eliminates non- wet interconnections between die and substrate solder bumps (see Figure 1).

              The key elements of the method include:

•             Implementation of a die-attach process in which the substrate is heated beyond the substrate bump solder melting point before the chip is attached

•             Force that is applied to form the interconnection between the substrate bumps and die bumps

•             Lower temperature for solder interconnection between die and substrate as the interconnect formation is assisted by the force that is applied

Advantages

              The disclosed method provides advantages, including:

•             Improved performance due to the bumps being molten during the die placement

•             Improved performance of the flux due to the improved removal of oxides because the flux is at a high temperature

•             Improved ease of manufacturing due to eliminating the requirement for excessive efforts in optimizing the flux formulation

•             Improved ease of manufacturing due to eliminating flux thickness interactions as force is used to attach the die bumps onto the substrate bumps

•             Improved ease of manufacturing due to eliminating the requirement to optimize the substrate solder bump surface characteristics because the bumps a...