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Method for mold compound materials with low surface energy

IP.com Disclosure Number: IPCOM000011840D
Publication Date: 2003-Mar-19
Document File: 3 page(s) / 111K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for mold compound materials with low surface energy. Benefits include improved reliability and improved ease of manufacturing.

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Method for mold compound materials with low surface energy

Disclosed is a method for mold compound materials with low surface energy. Benefits include improved reliability and improved ease of manufacturing.

Background

        � � � � � Conventional mold compound (MC) and overmold-as-underfill (OMUF) formulations usually do not incorporate low surface energy materials. Surfactants are typically considered to not improve MC wetting and adhesion characteristics because of their high melt viscosity and the relatively high temperatures at which MCs are processed. In the transfer-molding (TR) field, little focus is being placed on improving surface wetting by MC and OMUF materials� because mechanical processes such as vacuum assisted molding are employed.� However in practice, these processes have been found to be costly and difficult to control. Therefore, a materials-based solution that synergistically combines� improved� surface wetting with conventional molding processes and equipment is highly desirable and� should provide the best molding results in terms of improved wetting and minimized voids.

General description

        � � � � � The disclosed method is mold compound materials with low surface energy. MC and OMUF formulations have low surface energy compositions due to the incorporation of materials such as surfactants and coupling agents to improve wetting and adhesion.

        � � � � � The key elements of the method include:

•        � � � � Low surface energy MC and OMUF formulations

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved reliability due to optimized MC and OMUF adhesion

•        � � � � Improved reliability due to minimizing voids during package molding

•        � � � � Improved ease of manufacturing due to optimized surface wetting

Detailed description

        � � � � � The disclosed method is mold compound materials with low surface energy. Wetting and adhesion are improved for MC and OMUF materials to packaging components such as the following:

•        � � � � Substrate and die surfaces

•        � � � � Flip-chip bump materials

•        � � � � Wirebond wire

•        � � � � Die attach adhesives

        � � � � � Low surface energy components, such as surfactants, act as coupling agents into compound formulati...