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A low cost technique to implement a Faraday cage structure in a cavity down PBGA package

IP.com Disclosure Number: IPCOM000011867D
Original Publication Date: 2003-Mar-20
Included in the Prior Art Database: 2003-Mar-20
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Abstract

The present work discloses a low cost technique to accomplish a higher EMI shielding from environmental electromagnetic noise for a cavity down electronic plastic ball grid array package (PBGA).

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A low cost technique to implement a Faraday cage structure in a cavity down

PBGA package

The present work discloses a low cost technique to accomplish a higher EMI shielding from environmental electromagnetic noise for a cavity down electronic plastic ball grid array package (PBGA). This is achieved by electrically connecting the Copper stiffener, that is part of the package, with the use of a conductive media to the printed circuit laminate section, with the aim of accomplishing a possible integration of a full Faraday's cage that completely surrounds the emitting or receiving device.

  As shown on Fig.1 the module configuration presents a Copper stiffener that, as a result of manufacturing process techniques and flows, ends in being attached with an insulating adhesive to the printed circuit board (PCB) laminate section leaving the Copper stiffener electrically floating. In an expanding application space for this packages it becomes important to have this large metal features connected to electrical circuits, generally to a Ground potential, which are present on the PCB section.

Stiffener

ChipPCB

C onnecting M odule Ball Grid Array Insulating Adhesive

Fig. 1 Standard Cavity Down Module Configuration

  This publication discloses a technique to establish an electrical connection of the Cu stiffener to the GND wiring network present in the laminate section such as protruding Cu segments or lines, pads, or planes present on the surfaces of the laminate and the Cu stiff...