Browse Prior Art Database

Method for a frame for stiffening and attaching devices to a PCB

IP.com Disclosure Number: IPCOM000011935D
Publication Date: 2003-Mar-26
Document File: 3 page(s) / 141K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a frame for stiffening and attaching devices to a PCB. Benefits include improved thermal performance, improved reliability, improved ease of manufacturing, and improved design flexibility.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 57% of the total text.

Method for a frame for stiffening and attaching devices to a PCB

Disclosed is a method for a frame for stiffening and attaching devices to a PCB. Benefits include improved thermal performance, improved reliability, improved ease of manufacturing, and improved design flexibility.

General description

              The disclosed method is a frame for stiffening and attaching devices to a PCB.

Anchors (2 – 4, typically) are installed though holes in PCB to secure frame

 

A downward force is generated that secures the heatsink retention mechanism or other device and increases pullout resistance.

              The key elements of the method include:

•             PCB

•             Anchors

•             Frame

•             Thermal Solution

•             Clips

Advantages

              The disclosed method provides advantages, including:

•             Improved thermal performance due to improved downward force on the thermal interface material (TIM)

•             Improved reliability due to improved downward force on the device

•             Improved ease of manufacturing due to improving the board space used for attachment

•             Improved ease of manufacturing due to using though holes in the board

•             Improved ease of manufacturing due to improved flexibility for rework

•             Improved design flexibility due to the separation of thermal and mechanical reliability requirements

Detailed description

              The disclosed method is a frame for stiffening and attaching devices to a PCB. A

frame enables a spring device to provide downward force on a heatsink, TIM, and MCH (see Figure 1 & 2). The force increases the efficiency of the TIM between the MCH and heatsink and increases the efficiency of the solution. This improvement enables the use of smaller, less costly heatsinks (see Figure 2).

      The disclosed method enables the straight pins to be retained to the frame by bending the ends of the pins protruding above the frame by using a fixture and press. As a result, conventional pins can be reworked for improved retention.

 ®..