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Method for a low-CTE metal core design using slanted slot arrays

IP.com Disclosure Number: IPCOM000011940D
Publication Date: 2003-Mar-26
Document File: 4 page(s) / 41K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-coefficient of thermal expansion (CTE) metal core design using slanted slot arrays. Benefits include improved performance.

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Method for a low-CTE metal core design using slanted slot arrays

Disclosed is a method for a low-coefficient of thermal expansion (CTE) metal core design using slanted slot arrays. Benefits include improved performance.

Background

        � � � � � Conventional packaging technology associated with high-speed processor units requires high power, which results in high current flows throughout the package. High CTE or mechanical stress must be reduced for future packaging.

        � � � � � High thermal dissipation caused by high current flows at specific locations with high CTE deforms the package structure and significantly degrades the product’s reliability. While a metal core design has already reduced the package’s overall CTE, the results do not meet future requirements. As the operating frequency rises, these problems become more critical. Therefore, a reduced-CTE package design must be developed with little impact on overall electrical and thermal performance.

        � � � � � CTE and mechanical stress present major reliability issues. They are closely related to the local current and power supplied to the package. Conventional solutions rely on the development of new materials and may significantly affect the other attributes of package design such as electrical properties, cost models, and thermal solutions of the entire package system. Alternative solutions must be identified without major changes in conventional package technology.

General description

        � � � � � The disclosed method is a low-CTE metal core design using slanted slot arrays. In a metal core area, the slots reduce overall CTE/mechanical stress with minimal changes in electrical properties. The method reduces the manufacturing cost of laser drilling for pin through holes (PTHs).

        � � � � � Slanted slot arrays are created through the metal core layer along the direction of power PTH arrays using a conventional etching process. The slot is filled with build-up materials. With these slots, the overall stress from the core area decreases. The laser drilling process for the metal core layer PTH is no longer difficult and can greatly reduce the laser shots for each PTH via hole. This approach leads to a cost-effective process without additional manufacturing. The slanted slot arrays have little impact on the package power delivery system because the design continues to follow the conventional design rules.

        � � � � � The key elements of the method include:

•        � � � � Slanted slot arrays that are implemented through a metal core l...