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Method for a die-down FCBGA/FCPGA package with an embedded metal heat spreader as the package core

IP.com Disclosure Number: IPCOM000011942D
Publication Date: 2003-Mar-26
Document File: 3 page(s) / 76K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a die-down flip-chip ball grid array/flip-chip pin grid array (FCBGA/FCPGA) package with an embedded metal heat spreader as the package core. Benefits include improved thermal performance.

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Method for a die-down FCBGA/FCPGA package with an embedded metal heat spreader as the package core

Disclosed is a method for a die-down flip-chip ball grid array/flip-chip pin grid array (FCBGA/FCPGA) package with an embedded metal heat spreader as the package core. Benefits include improved thermal performance.

Background

              The conventional low-thermal-conductive package substrate is organic or epoxy resin/woven glass cloth (FR-4). The BGA package includes a single die (see Figure 1). Thermal management is a problem for a FCBGA package with a die-down configuration. The die-down configuration provides a shorter communication path between the die and the printed circuit board (PCB). However, this configuration prohibits the heat generated from the die to be dissipated through the topside of package body due to the low thermal conductivity of the core. Due to the space constraint between the die and the printed circuit board (PCB), the conventional heatsink solution cannot be applied to this die-down FCBGA package.

              Conventionally, thermal vias and pin throughholes (PTHs) are added to the package substrate in the die area. The thermal vias and PTHs reduce the substrate thermal resistance so that heat from the die can be more easily dissipated through the topside of the package body. However, the overall thermal resistance of the package substrate is still very high.

Description

              The disclosed method is a die-down FCBGA/FCPGA package with an embedded metal heat spreader as t...