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Method for a modular interface that accommodates high-speed test and adds thermal and scrambling capabilities

IP.com Disclosure Number: IPCOM000011944D
Publication Date: 2003-Mar-26
Document File: 4 page(s) / 497K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a modular interface that accommodates high-speed test and adds thermal and scrambling capabilities. Benefits include improved functionality and an improved test environment.

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Method for a modular interface that accommodates high-speed test and adds thermal and scrambling capabilities

Disclosed is a method for a modular interface that accommodates high-speed test and adds thermal and scrambling capabilities. Benefits include improved functionality and an improved test environment.

Background

        � � � � � The conventional solution is highly capacitive. It is a bottleneck for high-speed testing capabilities because it is limited to 64 signals with limited surface area that does not enable large footprint devices to be tested.

General description

        � � � � � The disclosed method is a modular interface, called the MI-3, which accommodates high-speed test and adds thermal and signal-scrambling capabilities. The method includes 6-inch coaxial cables to allow fast scrambling of signals, thermal cycling capability for hot and cold tests, and a direct-dock option for high-speed test with better performance and faster edges.

        � � � � � The MI-3 can be attached to any tester with a 0.100-inch header stake. The pogo block portion is assembled directly on the tester motherboard. (The motherboard is not part of the MI-3 assembly). The DirectDock option is advantageous for high-speed testing. For signal scrambling, the use of the cable assembly is optimal. A scope fixture and temperature cycling capability are available.

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to providing the cable option and the cable-free DirectDock option

•        � � � � Improved functionality due to supporting sockets up to 48 mm and up to 336 signals

•        � � � � Improved test environment due to adding signal scrambling, high-speed test support, a scope feature, and temperature cycling to any tester with a 0.100-inch header stake

•        � � � � Improved reliability due to improved signal reflections during signal scoping

Detailed description...