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The substrate support mechanism uses for through hole processing of the printed circuit board by laser

IP.com Disclosure Number: IPCOM000011950D
Original Publication Date: 2003-Mar-27
Included in the Prior Art Database: 2003-Mar-27
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Abstract

Disclosed is a supporting mechanism for a work panel at through hole forming process by laser drilling. When laser energy reaches the supporting panel on stage of laser drill machine after forming the through hole, the supporting material is decomposed by the laser energy and adhered to the work panel surface and through hole barrel as contamination. This invention disclosure provides the mechanism to prevent the work panel from contamination.

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THIS COPY WAS MADE FROM AN INTERNAL IBM DOCUMENT AND NOT FROM THE PUBLISHED BOOK

JP820021069 Fumio Koike/Japan/IBM Masaharu Yasuda, Kimihiro Yamanaka, Yutaka Tsukada

  The substrate support mechanism uses for through hole processing of the printed circuit board by laser

  Two backup panels to support the work panel are placed between a work panel  and a stage of laser drilling machine. One is referred backup panel 1 and the  other is backup panel 2 in the figure. 

The backup panel 1 (FR4 as material for example) is placed right under the  work panel to support it mechanically. This backup panel has the bigger  holes (0.7mm dia. for example) than the designed through hole in the same  position where the laser through hole is to form.  The backup panel 2 (FR4 as material for example) is placed right under the  backup panel 1. This backup panel has a rough surface and a small hole at  the peak of the surface as in figure The suction holes are provided in the stage of laser machine to stick the  work panel to the stage. This structure provides the way for the decomposed material of the  supporting panel to escape from of the work area by vacuum pressure�...