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Staggered Pocket Carrier Densification

IP.com Disclosure Number: IPCOM000012017D
Publication Date: 2003-Apr-02
Document File: 3 page(s) / 1M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a unique carrier geometry that ensures a maximum number of substrates per given area. Benefits include minimizing total carrier deflection under the integrated heat spreader (IHS) chip load.

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Staggered Pocket Carrier Densification

Disclosed is a method for a unique carrier geometry that ensures a maximum number of substrates per given area. Benefits include minimizing total carrier deflection under the integrated heat spreader (IHS) chip load.

Background

Currently, it is difficult to achieve maximum substrate densification without the degradation of carrier properties. The current state of the art rotates the IHS clip by 20 degrees to provide maximum pocket densification; however, this method warps the carrier.

General Description

Metal carriers are used in state-of-the-art processing for semiconductor packages (see Figure 1). Each carrier contains numerous pockets (e.g. 8,10 or 12 pockets) in which packages are loaded using an Automatic Part Loader (APL) for high volume production, or with a manual part loader (MPL) for low volume production (i.e. for design of experiments testing). The parts are restrained in the carrier by an E-spring. The equipment capability is dependent on the accuracy and precision of the carrier. The equipment utilizes carrier features to precisely locate semiconductor packages for module processing.

The disclosed method consists of a new and improved Front of Line (FOL) metal carrier geometry that maximizes the number of substrates a carrier can process, while minimizing the carrier deflection due to IHS clip loading. The pockets are staggered from the carrier center line to provide overlapping IHS slots, and ultimately minimize the pitc...