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Method for a heatsink for voltage regulator components

IP.com Disclosure Number: IPCOM000012029D
Publication Date: 2003-Apr-02
Document File: 3 page(s) / 328K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink for voltage regulator (VR) components. Benefits include improved thermal performance.

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Method for a heatsink for voltage regulator components

Disclosed is a method for a heatsink for voltage regulator (VR) components. Benefits include improved thermal performance.

Background

� � � � � Conventionally, processor and system voltage regulators are laid out on the motherboard (see Figure 1). The processor VR generates a significant amount of heat and requires a thermal solution. For example, if the processor is operating at 50W, the VR is required to supply 50W of power through it at a VCC supply voltage. This design implies a current flow of 30-50A through the three phases of the VR. The result is a thermal power dissipation of ~10W (at 80% VR efficiency) in the VR components.

        � � � � � Typically, the motherboard around the VR components has a higher copper content to enhance the in-plane conductivity to improve spreading and dissipate thermal power through the motherboard. For a processor operating at high power, the passive dissipation through the motherboard and natural convection from the transistors (MOSFETs) and inductors is insufficient, and an active thermal solution is required.

Description

        � � � � � The disclosed method is a heatsink placed on top of the voltage regulator components, improving cooling for VR components (such as field-effect transistors, inductors, and drivers) in a notebook environment.

        � � � � � Key elements of the method include:

•        � � � � Combination of a heatsink and a flexible thermal interface material (TIM)

•        � � � � Use of spring-loaded screws to mount the heatsink and TIM to the motherboard

•        � � � � One-piece aluminum heatsink

        � � � � � The thermal solut...