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Method for a heatsink for voltage regulator components

IP.com Disclosure Number: IPCOM000012029D
Publication Date: 2003-Apr-02
Document File: 3 page(s) / 352K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink for voltage regulator (VR) components. Benefits include improved thermal performance.

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Method for a heatsink for voltage regulator components

Disclosed is a method for a heatsink for voltage regulator (VR) components. Benefits include improved thermal performance.

Background

      Conventionally, processor and system voltage regulators are laid out on the motherboard (see Figure 1). The processor VR generates a significant amount of heat and requires a thermal solution. For example, if the processor is operating at 50W, the VR is required to supply 50W of power through it at a VCC supply voltage. This design implies a current flow of 30-50A through the three phases of the VR. The result is a thermal power dissipation of ~10W (at 80% VR efficiency) in the VR components.

              Typically, the motherboard around the VR components has a higher copper content to enhance the in-plane conductivity to improve spreading and dissipate thermal power through the motherboard. For a processor operating at high power, the passive dissipation through the motherboard and natural convection from the transistors (MOSFETs) and inductors is insufficient, and an active thermal solution is required.

Description

              The disclosed method is a heatsink placed on top of the voltage regulator components, improving cooling for VR components (such as field-effect transistors, inductors, and drivers) in a notebook environment.

              Key elements of the method include:

•             Combination of a heatsink and a flexible thermal interface material (TIM)

•             Use of spring-loaded screws to mount the heatsink and TIM to the motherboard

•             One-piece aluminum heatsink

              The thermal solut...