Browse Prior Art Database

Method for metal channels for fluid transfer to dissipate heat in a multilayer PWB

IP.com Disclosure Number: IPCOM000012116D
Publication Date: 2003-Apr-09
Document File: 4 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for metal channels for fluid transfer to dissipate heat in a multilayer printed wire board (PWB). Benefits include improved thermal performance, improved design flexibility, and improved ease of manufacturing.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 55% of the total text.

Method for metal channels for fluid transfer to dissipate heat in a multilayer PWB

Disclosed is a method for metal channels for fluid transfer to dissipate heat in a multilayer printed wire board (PWB). Benefits include improved thermal performance, improved design flexibility, and improved ease of manufacturing.

Background

              High levels of heat can affect the performance and possibly cause the failure of the external components and structures mounted on the surface of a package or PWB.

              Conventionally, components rely on the copper plane structures of the package or PWB to dissipate heat. Military applications have used metal tubing embedded in the circuit board during lamination.

              The placement of the completing surface of a metallized channel on a bonding material can conventionally be performed by tack bonding, such as tack bonding a metal feature/strip to the b-stage side of a sheet of resin coated copper (RCC) foil. The tack bonding process is utilized to temporarily join b-stage epoxy to other materials in some PCB shops and flex circuit board shops as a method to ensure alignment between circuit board layers.

              A second conventional method is etching a circuit feature from a copper (Cu) foil previously adhered to a B-stage/C-stage composite. This technique has been demonstrated in the various processing of RCC foils.

General description

      The disclosed method is formed metal channels for fluid transfer to dissipate heat in a multilayer PWB. The method includes the localized placement/formation of the completing surface of the metallized channel on the bonding/adhesive material prior to the laminating/bonding process. Several conventional techniques can achieve this result. Standard printed circuit board (PCB) processing techniques can be used to form the metal channel structure.

              An enclosed metallized channel is formed by bonding two pieces together. As long as portions of the bonding material are exposed to the surface of the material with the metallized trenches/channels, the two pieces bond/laminate together.

              The final step of the disclosed method is accessing the metallized channel to deliver thermal transfer fluid internal to the PCB for thermal management.

              The key elements of the method include:

•             Selective placement or formation of a metallized structure on a bonding/adhesive material

•             Metallized structure on bonding material to form a surface of the metallized channel after lamination/bonding

•             Metallized channels to form an enclosed path internal to the board for fluid transfer

•             Bonding of metallized structure on bonding material and metallized channel to form an enclosed path internal to board for fluid transfer

Advantages

              The disclosed method provides advantages, including:

•             Improved thermal performance due to improved board level heat...