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Method for metal channels for fluid transfer to dissipate heat in a multilayer PWB

IP.com Disclosure Number: IPCOM000012116D
Publication Date: 2003-Apr-09
Document File: 4 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for metal channels for fluid transfer to dissipate heat in a multilayer printed wire board (PWB). Benefits include improved thermal performance, improved design flexibility, and improved ease of manufacturing.

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Method for metal channels for fluid transfer to dissipate heat in a multilayer PWB

Disclosed is a method for metal channels for fluid transfer to dissipate heat in a multilayer printed wire board (PWB). Benefits include improved thermal performance, improved design flexibility, and improved ease of manufacturing.

Background

        � � � � � High levels of heat can affect the performance and possibly cause the failure of the external components and structures mounted on the surface of a package or PWB.

        � � � � � Conventionally, components rely on the copper plane structures of the package or PWB to dissipate heat. Military applications have used metal tubing embedded in the circuit board during lamination.

        � � � � � The placement of the completing surface of a metallized channel on a bonding material can conventionally be performed by tack bonding, such as tack bonding a metal feature/strip to the b-stage side of a sheet of resin coated copper (RCC) foil. The tack bonding process is utilized to temporarily join b-stage epoxy to other materials in some PCB shops and flex circuit board shops as a method to ensure alignment between circuit board layers.

        � � � � � A second conventional method is etching a circuit feature from a copper (Cu) foil previously adhered to a B-stage/C-stage composite. This technique has been demonstrated in the various processing of RCC foils.

General description

� � � � � The disclosed method is formed metal channels for fluid transfer to dissipate heat in a multilayer PWB. The method includes the localized placement/formation of the completing surface of the metallized channel on the bonding/adhesive material prior to the laminating/bonding process. Several conventional techniques can achieve this result. Standard printed circuit board (PCB) processing techniques can be used to form the metal channel structure.

        � � � � � An enclosed metallized channel is formed by bonding two pieces together. As long as portions of the bonding material are exposed to the surface of the material with the metallized trenches/channels, the two pieces bond/laminate together.

        � � � � � The final step of the disclosed method is accessing the metallized channel to deliver thermal transfer fluid internal to the PCB for thermal management.

        � � � � � The key elements of the method include:

•        � � � � Selective placement or formation of a metallized structure on a bonding/adhesive material

•        � � � � Metallized structure on bonding material to form a surface of the metallized channel after lamination/bonding

•        � � � � Metallized channels to form an enclosed path internal to the board for fluid transfer

•        � � � � Bonding of metallized structure on bonding material and metallized channel to form an enclosed path internal to board for fluid transfer

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved thermal performance due to improved board level heat...