Browse Prior Art Database

Method for an in-place board/package warpage apparatus

IP.com Disclosure Number: IPCOM000012117D
Publication Date: 2003-Apr-09
Document File: 4 page(s) / 123K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an in-place board/package warpage apparatus. Benefits include improved functionality, an improved test environment, and an improved development environment.

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Method for an in-place board/package warpage apparatus

Disclosed is a method for an in-place board/package warpage apparatus. Benefits include improved functionality, an improved test environment, and an improved development environment.

Background

        � � � � � Thermal warpage can create solder joint failures, coplanarity mismatches, and reductions of the effective interconnections. Actual thermal warpage information is required for determining the causes of warpage of printed circuit board (PCB) assemblies and electronic component packages during reflow soldering.

        � � � � � Thermal expansion linearly increases with temperature. Conventionally, thermal warpage information can only be gathered at room temperature. Valuable information for solving the warpage/reliability issues is being lost.

        � � � � � Warpage measurement is conventionally performed using several tools. During reflow, shadow moiré is used to measure the in-place warpage. However, this tool is limited to only warpage that occurs in a process chamber. Technical skills are required for performing the measurement. The data is shadow fringe data, which is not measured directly.

        � � � � � After reflow laser reflection measurement, slip gauge, and mechanical tools are used to measure warpage. However, these tools are only applicable to room temperature.

General description

        � � � � � The disclosed method is an in-place board/package warpage apparatus. Lightweight pins move upward with the support of a rubber membrane and stop at the maximum board height. Measuring the difference between the initial and maximum heights of each pin indicates the thermal warpage during reflow. Pins can be placed at any location.

        � � � � � The key elements of the method include:

•        � � � � Pins with a weight of about 0.01g – 0.05g per pin

•        � � � � Flat bar that serves as a reference point for pin height measurement

•        � � � � Rubber membrane valve that enables the pin to move in the upward direction only

•        � � � � Latch that releases the pin after measurement

•        � � � � Fixture to assemble these items as an apparatus without restricting the movement of the PCB or package

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to providing actu...