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Method for improving solder joint functionality for high-current socket contacts

IP.com Disclosure Number: IPCOM000012119D
Publication Date: 2003-Apr-09
Document File: 6 page(s) / 209K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for improving solder joint functionality for high-current socket contacts. Benefits include improved reliability.

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Method for improving solder joint functionality for high-current socket contacts

Disclosed is a method for improving solder joint functionality for high-current socket contacts. Benefits include improved reliability.

Background

        � � � � � As current and temperatures increase, the possibility of long-term degradation of solder joints increases. No conventional solution for this condition exists.

        � � � � � A conventional high-current socket concept has a large cantilevered contact that interfaces between the board and the component (see Figure 1). Some proposed high-current socket contact designs offer marked improvement in board, socket, and component resistance. A short-channel pad design along with a reduced count of large contacts improves resistance by ~30%. However, one potential drawback is that large contacts tend to have lower solder volume than conventional designs.

        � � � � � When the contact is implemented in a socket, fewer contacts can be used (see Figure 2). A higher force per contact is achievable for the same socket insertion force, lowering the interface resistance. The size of the contact maintains a low bulk resistance even though the total contact count has decreased versus typical land grid array (LGA) style sockets. The socket design can function with an optimized board design to deliver an overall lower loadline. These theoretical improvements are believed to be contributing factors in the measured resistance differences (see Figure 3). One drawback is that the solder ball count also decreases with lower contact count, which could lead to excessive electromigration as system temperatures and currents rise.

General description

        � � � � � The disclosed method improves solder joint functionality for high-current socket contacts. The key elements of the method include:

•        � � � � Techniques and an apparatus for improving the solder joints of some designs for high-current socket contacts

•        � � � � Techniques for assembling the designs

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved reliability due to improved solder volume that can be realized with high-current socket concepts

� � � � � Detailed description

        � � � � � The disclosed method improves solder joint functionality for high-current socket contacts. Solder tabs enable a higher solder volume per cont...