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Method for a plug-and-play anti-warpage wafer boat for thin warped wafers

IP.com Disclosure Number: IPCOM000012120D
Publication Date: 2003-Apr-09
Document File: 3 page(s) / 277K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a plug-and-play anti-warpage wafer boat for thin warped wafers. Benefits include improved functionality and improved productivity.

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Method for a plug-and-play anti-warpage wafer boat for thin warped wafers

Disclosed is a method for a plug-and-play anti-warpage wafer boat for thin warped wafers. Benefits include improved functionality and improved productivity.

Background

        � � � � � Wafer warpage up to 15 mm can occur during wafer thinning. The warpage is increased by the effect of gravity during the loading of the wafer into the wafer boat. The main cause is typically the lack of support provided to the thin wafer where the side wing width is only 3 mm. As a result, a warped wafer cannot be placed into a conventional wafer boat.

        � � � � � Conventionally, wafers are transferred directly after the back grinding process to a manual mounting process without using the wafer boat. Handling is performed with the aid of a vacuum-assisted handler.

General description

        � � � � � The disclosed method is a plug-and-play anti-warpage wafer boat for thin warped wafers.

The method is a fixture that can be entered and removed through a slot in a conventional wafer boat. Holders can accommodate thin or thick wafer applications. Thin wafers fit within the slot because of the slot’s larger circumference. The slot’s center point support provides a structure to hold the thin wafer (3 mils) within the slot. The support fixture prevents the thin wafer from warping and breaking due to its own weight.

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to accommodating wafer warpage when wafers are seated within the wafer boats

•        � � � � Improved productivity due...