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Method for a universal wave pallet

IP.com Disclosure Number: IPCOM000012196D
Publication Date: 2003-Apr-16
Document File: 8 page(s) / 501K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a universal wave pallet. Benefits include improved throughput, improved design flexibility, cost saving and an improved design environment.

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Method for a universal wave pallet

Disclosed is a method for a universal wave pallet. Benefits include improved throughput, improved design flexibility, cost saving and an improved design environment.

Background

              Wave pallet fabrication cost and fabrication turnover time is a roadblock for new product introduction (NPI) for printed circuit board assembly (PCBA).

              Boards come in with various sizes. The conventional solution is a fix size wave pallet (figure 1), which carries various sizes of boards, but custom for each model. However, preparation for wave pallets typically takes 1 week, extending the NPI/prototype building process. Additionally, the pallet is expensive.

General description

              The disclosed method is a universal wave pallet (figure 2) that can be used for multiple board sizes. The pallet has the following characteristics:

•             Capable of carrying various sizes of boards through wave solder processing

•             Easy conversion to various sizes with no modification needed.

•             Quality that is equal or better than the conventional wave pallets

•             No additional process requirements, such as wave solder scoped by the wave pallet and cleaning

•             Useful life equal or better than the conventional wave pallets.

•             Repairable.

              The universal wave pallet reduces the time required for the preparation for wave pallets during the prototype-building process from 1 week to a few minutes and cost saving for wave pallet fabrication.

Advantages

              The disclosed method provides advantages, including:

•             Improved throughput due to improving the time required for the preparation for wave pallets during the prototype-building process

•             Improved design flexibility due to the adjustability of the pallet

•             Improved development environment due to reducing the total number of wave pallets required by ~80%

•             Improved cost effectiveness due to cost saving for wave pallet fabrication.

Detailed description

              The disclosed universal wave pallet is adjustable to various board sizes by moving the X- and Y-axis bars to change the opening size (see Figures 3). Milling down the opening is important to various board layouts where retention connectors, such as the audio and microphone connectors, protrude from the PCB (see Figure 4). Adjustable board clamps move in the X or Y direction to hold the board on the universal wave pallet (see Figure 5). The opening at the tailing edge for the prevention of wave solder from being trapped by the wave pallet (see Figure 6).

              The universal wave pallet has a framework of 2.0-cm width aluminum. The material that holds the PCB is 1-cm thick cast stone (see Figure 7). The pallet weighs 1.3 kg, which is within the tolerance for the carry weight of 20 kg per conveyor and equal to the ~3 kg per pallet loading limit.

              A comparison of the profiles for the conventional wave pallet and the...