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Method for a chamfer ledge handling media to accommodate BGA interconnect circuit packages that are fully populated

IP.com Disclosure Number: IPCOM000012197D
Publication Date: 2003-Apr-16
Document File: 3 page(s) / 56K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a chamfer ledge handling media to accommodate ball grid array (BGA) interconnect circuit packages that are fully populated. Benefits include improved functionality and improved performance.

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Method for a chamfer ledge handling media to accommodate BGA interconnect circuit packages that are fully populated

Disclosed is a method for a chamfer ledge handling media to accommodate ball grid array (BGA) interconnect circuit packages that are fully populated. Benefits include improved functionality and improved performance.

Background

        � � � � � If changes are made to a substrate ball pattern, such as a tighter ball pitch, the substrate may require conversion to another media. Conversion has a long tooling fabrication leadtime. Replacing all existing media in the manufacturing line is costly.

        � � � � � Package design can require an alternative pinout to avoid growing the package size. Existing package design rules require a ball depopulation design for the unit to sit on to the tray in a life-bug position. This ball depopulation design results in a larger, costly package size.

� � � � � Conventional media has a flat resting platform, called a support ledge, for the unit to sit in the media pocket.

� � � � � A solution is required for designing and replacing existing media to meet substrate ball depopulation at the substrate peripheral edges (~1000 mm), package center edges (12 center edge balls removed), or package corners (11 corner balls removed).

Description

� � � � � The disclosed method is a handling media that utilizes a chamfer (angled) ledge to support unit seating in the media pockets (see Figure 1). The method self-aligns the substrate. The seating ledge accom...