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Method for a chamfer ledge handling media to accommodate BGA interconnect circuit packages that are fully populated

IP.com Disclosure Number: IPCOM000012197D
Publication Date: 2003-Apr-16
Document File: 3 page(s) / 105K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a chamfer ledge handling media to accommodate ball grid array (BGA) interconnect circuit packages that are fully populated. Benefits include improved functionality and improved performance.

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Method for a chamfer ledge handling media to accommodate BGA interconnect circuit packages that are fully populated

Disclosed is a method for a chamfer ledge handling media to accommodate ball grid array (BGA) interconnect circuit packages that are fully populated. Benefits include improved functionality and improved performance.

Background

              If changes are made to a substrate ball pattern, such as a tighter ball pitch, the substrate may require conversion to another media. Conversion has a long tooling fabrication leadtime. Replacing all existing media in the manufacturing line is costly.

              Package design can require an alternative pinout to avoid growing the package size. Existing package design rules require a ball depopulation design for the unit to sit on to the tray in a life-bug position. This ball depopulation design results in a larger, costly package size.

      Conventional media has a flat resting platform, called a support ledge, for the unit to sit in the media pocket.

      A solution is required for designing and replacing existing media to meet substrate ball depopulation at the substrate peripheral edges (~1000 mm), package center edges (12 center edge balls removed), or package corners (11 corner balls removed).

Description

      The disclosed method is a handling media that utilizes a chamfer (angled) ledge to support unit seating in the media pockets (see Figure 1). The method self-aligns the substrate. The seating ledge accom...