Browse Prior Art Database

Method for a drop-in heatsink/heat slug with a well mold for MMAP LDI technology

IP.com Disclosure Number: IPCOM000012199D
Publication Date: 2003-Apr-16
Document File: 6 page(s) / 103K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a drop-in heatsink/heat slug with a well mold for molded matrix array package (MMAP) low-density interconnect (LDI) technology. Benefits include improved thermal performance.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 42% of the total text.

Method for a drop-in heatsink/heat slug with a well mold for MMAP LDI technology

Disclosed is a method for a drop-in heatsink/heat slug with a well mold for molded matrix array package (MMAP) low-density interconnect (LDI) technology. Benefits include improved thermal performance.

Background

        � � � � � Heat dissipates from microprocessors in molded packages. The temperature loss must be controlled to meet die junction-temperature (Tj) targets. Historically, heat removal has been a concern for central processor unit (CPU) products only. The demand for more complexity and functionality from LDI non-CPU products increases their power consumption. The power level for these devices is increasing rapidly, and heat removal is becoming critical for this market segment as well. Standard non-CPU processors are molded using nonconductive molding compounds. These molding materials resist the heat generated by the internal die by dissipating out to the ambient environment, potentially creating reliability issues.

        � � � � � CPU products with higher power conventionally use heat dissipation technologies. An integrated heat spreader directs the heat from the die. Then, a heatsink dissipates the heat to the ambient environment. This package-level solution for heat removal adds significant cost to the total package cost and is prohibitive for the low-cost non-CPU market.

        � � � � � A direct die-referencing solution exposes the backside of the die and connects it to the heatsink, using a thermal interface material (TIM) such as grease or phase-change material.

        � � � � � For MMAP non-CPU packages, a conventional solution is to have a lower/limited power delivered to the package.

        � � � � � MMAP type molding is critical in the LDI non-CPU market segment for meeting low cost targets and high units per hour (UPH) targets. Molding compounds are required to mechanically seal the packages and provide good reliability performance.

        � � � � � Conventional molding uses a flat mold compound surface with a flat heat slug (see Figure 1).

        � � � � � A conventional well mold design is produced by injection molding where a plunger introduces the mold material into a reservoir. The package is overmolded (see Figure 2).

General description

        � � � � � The disclosed method is a drop-in heatsink/heat slug with a well mold for molded matrix array package (MMAP) low-density interconnect (LDI) technology. The disclosed method is applicable to molded LDI packages where heat transfer from the die through the molding compound is critical.

        � � � � � The key elements of the method include:

•        � � � � Drop-in heatsink or heat slug that is a generic heatsink or heat slug design with a protrusion of some area of the heatsink/heat slug base

•        � � � � Well mold design with some portion of the molding surface removed at the center of the die

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved thermal performance due to the lessening of the heat-path resist...