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Method for strengthening the component-to-board solder joint through the increase of component package ball-grid pad surface areas and annulations

IP.com Disclosure Number: IPCOM000012345D
Publication Date: 2003-Apr-30
Document File: 3 page(s) / 81K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for strengthening the component-to-board solder joint through the increase of component package ball-grid pad surface areas and annulations. Benefits include improved reliability.

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Method for strengthening the component-to-board solder joint through the increase of component package ball-grid pad surface areas and annulations

Disclosed is a method for strengthening the component-to-board solder joint through the increase of component package ball-grid pad surface areas and annulations. Benefits include improved reliability.

Background

        � � � � �

        � � � � � Component-to-board solder joint strength failures are detected during reliability stress testing. Typical failures are fatigue and brittle joint cracking at high-stress areas and cracking between the solder ball and the component or board metal pads interface. The stresses that cause failures include:

•        � � � � Temperature cycling that represent the operating life of the product

•        � � � � Shock and vibration as occur during shipment and handling

        � � � � � The conventional methods of increasing solder joint thermal/mechanical strength for the package-to-solder joint interface include:

•        � � � � Increasing the metal pad diameter opening

•        � � � � Using bigger solder balls

•        � � � � Placing sacrificial balls in high-stress areas of the component ball fields

        � � � � � Micro-vias provide layer-to-layer electrical circuit connection. The two most common methods of via formation is photo and laser drill. On the surface mount component, solder joints connect the component to the board. However, solder-joint strength and reliability have posted major challenges to packaging technology development. As the pitch is getting tighter from 1.27-mm to 1.00-mm to 0.8-mm minimum ball pitch the ability to provide improved solder joint strength and reliability present a major challenge.

Description

� � � � � The disclosed method strengthens the component-to-board solder joint through the increase of component package ball-grid pad surface are...