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Method for a drop-on-demand unit-level ink mark for flexible tape FSCSP and molded SCSP and VF-BGA packages

IP.com Disclosure Number: IPCOM000012350D
Publication Date: 2003-Apr-30
Document File: 2 page(s) / 334K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a drop-on-demand unit-level ink mark for flexible tape folded stacked chip scale packages (FSCSP) and molded stacked chip scale packages (SCSP) and very fine-ball grid array (VF-BGA) packages. Benefits include improved yield.

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Method for a drop-on-demand unit-level ink mark for flexible tape FSCSP and molded SCSP and VF-BGA packages

Disclosed is a method for a drop-on-demand unit-level ink mark for flexible tape folded stacked chip scale packages (FSCSP) and molded stacked chip scale packages (SCSP) and very fine-ball grid array (VF-BGA) packages. Benefits include improved yield.

Background           

              Conventional ink marking requires pads to transfer the ink mark to the device, requiring the system to touch the device and potentially cause damage.

             

              Conventional laser marking technology is unable to mark the flexible tape of FSCSPs without damaging the tape layer.

 

Description

              The disclosed method is a drop-on-demand unit-level ink mark for FSCSP and molded SCSP and VF-BGA packages. The main components of the drop on demand mark system are a drop-on-demand print head and a handling system (see Figures 1 and 2). A vision system locates a unit for marking and communicates the location to the mark head, which applies the mark to the unit. By using the drop on demand technology combined with a material handling system, the method provides a highly accurate, high-throughput ink mark that does not touch the substrate, removing the potential for substrate damage. The print head produces a high contrast mark with excellent print quality.

              The disclosed method is used for unit-level marking for folded SCSPs to provide unit-level traceability for assembly and test...