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Method for a drop-on-demand unit-level ink mark for flexible tape FSCSP and molded SCSP and VF-BGA packages

IP.com Disclosure Number: IPCOM000012350D
Publication Date: 2003-Apr-30
Document File: 2 page(s) / 736K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a drop-on-demand unit-level ink mark for flexible tape folded stacked chip scale packages (FSCSP) and molded stacked chip scale packages (SCSP) and very fine-ball grid array (VF-BGA) packages. Benefits include improved yield.

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Method for a drop-on-demand unit-level ink mark for flexible tape FSCSP and molded SCSP and VF-BGA packages

Disclosed is a method for a drop-on-demand unit-level ink mark for flexible tape folded stacked chip scale packages (FSCSP) and molded stacked chip scale packages (SCSP) and very fine-ball grid array (VF-BGA) packages. Benefits include improved yield.

Background        � � �

        � � � � � Conventional ink marking requires pads to transfer the ink mark to the device, requiring the system to touch the device and potentially cause damage.

        � � � � �

        � � � � � Conventional laser marking technology is unable to mark the flexible tape of FSCSPs without damaging the tape layer.

Description

        � � � � � The disclosed method is a drop-on-demand unit-level ink mark for FSCSP and molded SCSP and VF-BGA packages. The main components of the drop on demand mark system are a drop-on-demand print head and a handling system (see Figures 1 and 2). A vision system locates a unit for marking and communicates the location to the mark head, which applies the mark to the unit. By using the drop on demand technology combined with a material handling system, the method provides a highly accurate, high-throughput ink mark that does not touch the substrate, removing the potential for substrate damage. The print head produces a high contrast mark with excellent print quality.

        � � � � � The disclosed method is used for unit-level marking for folded SCSPs to provide unit-level traceability for assembly and test...