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Browse Prior Art Database

Dummy Heat Sink

IP.com Disclosure Number: IPCOM000012366D
Original Publication Date: 2003-May-01
Included in the Prior Art Database: 2003-May-01
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Abstract

The dummy heat sink is a molded plastic part designed to occupy the open space left when fewer than the maximum number of CPUs is installed in a server.

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This is the abbreviated version, containing approximately 100% of the total text.

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Dummy Heat Sink

         The dummy creates air flow impedance which forces air to travel through the areas where CPUs require air for cooling, rather than allowing that air to bypass the CPUs. The dummy enables the following advantages: a) increased reliability for installed CPUs; b) in extreme cases, the dummy allows CPUs to operate when bypass air might otherwise cause them to overheat; c) low-cost add to the system for design robustness; d) dummy is tool-less, allowing easy removal for CPU installation by customer without any kind of tool. Unoccupied CPU sockets in a server capable of running with more than one processor provide an unimpeded path for air. Air will follow the path of least resistance when traveling through a server, and if empty sockets are left unimpeded, that air will bypass sockets where CPUs are installed. This will shorten the life of the processors or cause them to overheat. The dummy creates obstruction in these empty processor locations, forcing air to move through the occupied slots, thereby maximizing cooling

Disclosed by International Business Machines Corporation

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