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Method for a stacked package with a wire-bond interconnect

IP.com Disclosure Number: IPCOM000012435D
Publication Date: 2003-May-07
Document File: 3 page(s) / 138K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a stacked package with a wire-bond interconnect. Benefits include improved functionality and improved design flexibility.

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Method for a stacked package with a wire-bond interconnect

Disclosed is a method for a stacked package with a wire-bond interconnect. Benefits include improved functionality and improved design flexibility.

Background

        � � � � � Conventional stacked package options require solder ball interconnection between packages. This arrangement adds undesirable height (z-direction) to the total package solution.

        � � � � � The conventional solution uses solder balls to form the interconnection between package stacks. The interconnection is successful but adds height to the finished package.

� � � � � Standard packaging technology includes the following:

•� � � � A folded chip scale package concept that uses solder balls for the interconnection (see Figure 1)

•� � � � Stacked package concept that uses solder balls and an interposer (see Figure 2)

General description

        � � � � � The disclosed method is an interconnection for multiple package stack configurations using wire-bond technology. The key elements of the method include:

•� � � � Wire-bonding to interconnect two or more stacked packages

•� � � � Capability to remove solder balls from stacked package to reduce the height due to wire-bond interconnection of the stacked package

•� � � � Support for the over-mold operation in final assembly per the standard high-volume manufacturing process

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to reducing the height of the stacked package because of wire-bond interconnection

•        � � � � Improved design flexibility due to the capability of being used with or without solder balls when the package is routed as if solder balls were present

Detailed description

        � � � � � The disclosed method uses wire bonding for stacked-package interconnections. This method can be used with several different types of configurations, either from top side or bottom side of the substrate from the...