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Method for a stacked package with a wire-bond interconnect

IP.com Disclosure Number: IPCOM000012435D
Publication Date: 2003-May-07
Document File: 3 page(s) / 148K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a stacked package with a wire-bond interconnect. Benefits include improved functionality and improved design flexibility.

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Method for a stacked package with a wire-bond interconnect

Disclosed is a method for a stacked package with a wire-bond interconnect. Benefits include improved functionality and improved design flexibility.

Background

              Conventional stacked package options require solder ball interconnection between packages. This arrangement adds undesirable height (z-direction) to the total package solution.

              The conventional solution uses solder balls to form the interconnection between package stacks. The interconnection is successful but adds height to the finished package.

      Standard packaging technology includes the following:

•     A folded chip scale package concept that uses solder balls for the interconnection (see Figure 1)

•     Stacked package concept that uses solder balls and an interposer (see Figure 2)

General description

              The disclosed method is an interconnection for multiple package stack configurations using wire-bond technology. The key elements of the method include:

•     Wire-bonding to interconnect two or more stacked packages

•     Capability to remove solder balls from stacked package to reduce the height due to wire-bond interconnection of the stacked package

•     Support for the over-mold operation in final assembly per the standard high-volume manufacturing process

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to reducing the height of the stacked package because of wire-bond interconnection

•             Improved design flexibility due to the capability of being used with or without solder balls when the package is routed as if solder balls were present

Detailed description

              The disclosed method uses wire bonding for stacked-package interconnections. This method can be used with several different types of configurations, either from top side or bottom side of the substrate from the...