Browse Prior Art Database

Method for an IHS attachment to an IC package using stake pinning techniques

IP.com Disclosure Number: IPCOM000012444D
Publication Date: 2003-May-07
Document File: 3 page(s) / 76K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated heat spreader (IHS) attachment to an integrated circuit (IC) package using stake pinning techniques. Benefits include improved reliability.

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Method for an IHS attachment to an IC package using stake pinning techniques

Disclosed is a method for an integrated heat spreader (IHS) attachment to an integrated circuit (IC) package using stake pinning techniques. Benefits include improved reliability.

Background

        � � � � � As processor frequency and power increase, cooling requirements and costs increase. A requirement exists to reduce the cost of an IHS and its attachment process. Cost improvements can be achieved with an improved design and reduced assembly steps.

        � � � � � Conventional IHSs have selective gold plating with plating over the die. The IHS is flat (0‑35 µm) and clips on top of the die to maintain its position.

        � � � � � Integrated heat spreaders are conventionally attached to the package using a sealant-dispense process that requires curing (see Figure 1). The general processing steps are:

1.        � � Dispense sealant onto the substrate.

2.        � � Dispense flux onto the die.

3.        � � Pick-and-place a solder preform onto the die.

4.        � � Dispense flux onto the solder perform.

5.        � � Place the integrated heat spreader.

6.        � � Reflow the thermal interface solder.

7.        � � Cure the sealant adhesive.

8.        � � Remove the spring clip.

General description

        � � � � � The disclosed method attaches an IHS to an IC package, using stake pinning techniques. A set of stake pin features is integrated into the substrate. The heat spreader is lowered over the pins and staked into position, mechanically attaching the IHS to the package

        � � � � � The key elements of the method include:

•        � � � � Pin features incorporated into the substrate

•        � � � � Holes in the IHS matching the stake pins

•        � � � � Precision-forming die used to stake the IHS to the pins

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved reliability due to preventing sealant delamination, which results in the failure of the seal

•        � � � � Improved process simplicity due to eliminating the conventional sealant-dispense, sealant-cure, spring clip placement and sprint clip removal process steps

•        � � � � Improved cost effectiveness due to eliminating pro...