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GELLED COMPOSITIONS FOR EPOXY-BASED SYSTEMS

IP.com Disclosure Number: IPCOM000012463D
Publication Date: 2003-May-08

Publishing Venue

The IP.com Prior Art Database

Related People

Don Werkema: CONTACT [+3]

Abstract

Gelled compositions involving epoxy-based resins or epoxy-based systems for coatings and other applications are disclosed which comprise a matrix liquid, e.g., epoxy resin or system, and a gellant. The disclosed gellants, which are preferably polymeric amide-containing materials (e.g., polyamides), are readily incorporated into the epoxy-based formulations by mild heating and shear mixing to form, when cooled, homogeneous, very weak to solid clear gels. The desired rheological properties can be tailored by the gellant loading in the formulation.

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TECHNICAL DISCLOSURE

GELLED COMPOSITIONS FOR EPOXY-BASED SYSTEMS

A.                 ABSTRACT

Gelled compositions involving epoxy-based resins or epoxy-based systems for coatings and other applications are disclosed which comprise a matrix liquid, e.g., epoxy resin or system, and a gellant.  The disclosed gellants, which are preferably polymeric amide-containing materials (e.g., polyamides), are readily incorporated into the epoxy-based formulations by mild heating and shear mixing to form, when cooled, homogeneous, very weak to solid clear gels.  The desired rheological properties can be tailored by the gellant loading in the formulation.

B.                 BRIEF SUMMARY OF THE TECHNOLOGY

The present disclosure teaches gelling agents, and especially polymeric gelling agents (i.e., gelling agents that are polymeric) in combination with epoxy-based resins or epoxy-based systems (epoxy), and optionally other components, collectively “the composition”.  The combination of gelling agent and epoxy may be a liquid at room temperature, however, the composition is preferably more viscous than the epoxy alone, where this increased viscosity is desirable for many reasons as discussed below.  Alternatively, the composition may be a liquid at elevated temperature but a gel at a reduced temperature, e.g., room temperature.  The composition comprising gelling agent and epoxy may further contain a solvent, e.g., a hydrocarbon liquid such as xylene and/or other ingredients.  The composition may contain components that have functional groups, e.g., an epoxy, alcohol, aromatic ring, ether, ester and/or alkene group.  It has been discovered that gelling agents which have previously been described as gellants for solvent may be used to thicken or gel epoxy.  These gelling agents have also been described in the technical and patent literature as structuring agents, thickeners or thixotropic agents. 

The gels and compositions disclosed herein may be formulated into various articles of manufacture.  Such articles of manufacture are described more fully below, but include coatings, adhesives and in structural components, which are desirable in a gel or thickened state.

C.                 EPOXY

Epoxy resins (referred to herein as “epoxy”) are characterized by the presence of a three-membered ring known variously as an epoxy, epoxide, oxirane or ethoxyline group.  Epoxy is typically made up from monomers and/or prepolymers that can react with curing agents to produce thermoset plastics.  Commercial epoxy resins contain cycloaliphatic or aliphatic frameworks to which are attached the epoxy ring(s).  The capability of the epoxy ring to react with a variety of substrates imparts versatility to the resins.  Treatment with curing agents provides insoluble and intractable thermoset polymers.  In order to facilitate processing and modify the final resin properties, other components such as rheological modifiers, fillers, solvents, diluents, plasticizers and accelerators, may be added to the formulation.  Epoxy resi...