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Z-axis mounted Inertial Sensor or Integrated Circuit

IP.com Disclosure Number: IPCOM000012686D
Publication Date: 2003-May-20
Document File: 3 page(s) / 73K

Publishing Venue

The IP.com Prior Art Database

Abstract

To vertically mount an integrated circuit or micro-machined (micromachined or MEMS) device, etc., arrange the wirebond layout of the die so that all the wirebond connections are made at one end of the die. Alternately, arrange the wirebond layout of the die so that all the wirebond connections are made on multiple ends or edges of the die that are adjacent to the package pins (solder leads).

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Z-axis mounted Inertial Sensor or Integrated Circuit

Abstract 

To vertically mount an integrated circuit or micro-machined (micromachined or MEMS) device, etc., arrange the wirebond layout of the die so that all the wirebond connections are made at one end of the die.  Alternately, arrange the wirebond layout of the die so that all the wirebond connections are made on multiple ends or edges of the die that are adjacent to the package pins (solder leads).

Background 

Sometimes there is a need to vertically mount an integrated circuit or similarly packaged device (e.g. isolators; micro-machined products) to a circuit board or other surface.  For example, surface micro-machined inertial sensors, such as those available today, typically only sense in a horizontal plane, that is in the plane parallel to the surface of the die.  The die are assembled into packages with leads on two or four edges which are mounted horizontally to a board such that the surface of the die is parallel to the board.  Thus the sensor can only sense in the plane of the board.

To accomplish vertical (z-axis) sensing, the package must be mounted vertically, i.e. on its edge.  In this configuration the surface of the die is perpendicular to the board (i.e. a vector normal to the flat surface of the die is parallel to the board).  This can be done by routing all the signals to one edge of the package.  Unfortunately, the package becomes longer to accommodate the signal routing.  This results in the package being taller when mounted on its edge.  This is undesirable for two reasons.  First, the height of the mounted board is a significant issue for most applications as it increases the thickness of the product.  Secondly, the taller the package, the more susceptible it is to vibrations which can affect it’s performance as a sensor.

Invention 

The inventive solution is to change the wirebond layout of the die so that all the wirebond connections are made at one end of the die.  This allows the use of a package that has all...