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Method for bond wire sealant

IP.com Disclosure Number: IPCOM000012702D
Publication Date: 2003-May-21
Document File: 2 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for bond wire sealant. Benefits include improved performance and improved reliability.

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Method for bond wire sealant

Disclosed is a method for bond wire sealant. Benefits include improved performance and improved reliability.

Background

        � � � � � Bond wire sealant quality and reliability issues include wire sweep, breakage, and corrosion. Conventionally, the entire package is encapsulated.

Description

        � � � � � The disclosed method is the application of sealant to the bond wire between the substrate and die (see Figure 1). The entire package is not encapsulated, enabling the product to function while protecting the wires from the elements.

        � � � � � The key elements of the method include:

•        � � � � Only the wire is encapsulated, saving material and increasing the reliability of the package

•        � � � � Sealed cavity is applied on top of the die, which is not possible if the entire package is encapsulated

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved performance due to encapsulating the wires while enabling the product to function

•        � � � � Improved reliability due to protecting the wires from the elements

•        � � � � Improved cost effectiveness due to saving material

Fig. 1

Disclosed anonymously