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Method for a continuous wetting heatsink for test and burn-in

IP.com Disclosure Number: IPCOM000012704D
Publication Date: 2003-May-21
Document File: 2 page(s) / 47K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a continuous wetting heatsink for test and burn-in. Benefits include improved thermal performance, an improved test environment, and improved ease of implementation.

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Method for a continuous wetting heatsink for test and burn-in

Disclosed is a method for a continuous wetting heatsink for test and burn-in. Benefits include improved thermal performance, an improved test environment, and improved ease of implementation.

Background

� � � � � Conventional test handlers utilize liquid thermal interface materials (TIMs). The liquid is applied only prior to the temporary attachment of the device under test (DUT) to the heatsink. Test times are sometime long and test temperatures are high enough to cause liquid loss via evaporation. Performance degradation is often observed, impacting product yield and making liquid interfaces impractical. No conventional solution exists for this problem.

� � � � � Data exists which clearly demonstrates that the evaporation of the liquid interface results in an increase in device junction temperature.

General description

        � � � � � The disclosed method is a heatsink with microchannels or based on a porous metal that enables the continuous wetting of the thermal interface between the heatsink and the DUT for use in device testing and other possible applications requiring a high performance temporary thermal interface.

� � � � � The disclosed method works on the principles of gravity and capillary action, which under the correct design conditions draw liquid into the interface between the heatsink and device under test.

        � � � � � The key elements are:

•� � � � Machined heatsink

•� � � � Fluid Reservoir

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