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Method for stringer elimination for saw singulation for tape substrates

IP.com Disclosure Number: IPCOM000012707D
Publication Date: 2003-May-21
Document File: 3 page(s) / 68K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for stringer elimination for saw singulation for tape substrates. Benefits include improved throughput.

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Method for stringer elimination for saw singulation for tape substrates

Disclosed is a method for stringer elimination for saw singulation for tape substrates. Benefits include improved throughput.

Background

              Stringers conventionally form when a saw blade cannot cut cleanly through substrate material at the unsupported substrate edge (see Figure 1).

              Conventional methods use additional equipment and process steps to reduce the stringer length. These methods do not solve the problem. They only remove the stringer after it has formed.

Description

              The disclosed method is stringer elimination for saw singulation for tape substrates. The main component of the method is the via structure, which mechanically strengthens the substrate’s free edges during the singulation process. Prior to singulation, the via structure is placed at the package corners of the substrate strip. The location depends on the layout of the strip. As the saw cuts the substrate into individual packages, it cuts though the substrates. As the saw blade cuts, it pushes towards a free (unsupported) edge. The via-structure supports the substrate material and enables the saw blade to remove all material, preventing stringer formation (see Figure 2).

 

              The via size is determined by the size of the saw blade and the positional tolerance stack up of the strip and blade. The placement of the vias is determined by the saw pattern. A via can be placed at any location where the bla...