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Method for a bridged mounting pad with reduced ESL for a multi-terminal decoupling capacitor

IP.com Disclosure Number: IPCOM000012709D
Publication Date: 2003-May-21
Document File: 2 page(s) / 52K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a bridged mounting pad with reduced equivalent series inductance (ESL) for a multi-terminal decoupling capacitor. Benefits include improved performance.

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Method for a bridged mounting pad with reduced ESL for a multi-terminal decoupling capacitor

Disclosed is a method for a bridged mounting pad with reduced equivalent series inductance (ESL) for a multi-terminal decoupling capacitor. Benefits include improved performance.

Background

        � � � � �         � � � � � The conventional multi-terminal decoupling capacitor has isolated and bridged terminals (see Figure 1). Alternating power and ground terminals reduce the overall ESL values because of a short inductance loop between adjacent terminals. One typical power plane connects four power terminals while the other four terminals are connected through isolated capacitor (cap) pads, which increase the overall ESL value. The bridged terminal pad is required to reduce the ESL and enhance the decoupling solutions.

Description

        � � � � � The disclosed method is a mounting-pad design with reduced ESL for an 8-terminal (8‑T) interdigitated chip (IDC) decoupling capacitor (decap). All the terminals on the pad are bridged (common) terminals (see Figure 2).� As a result, the cap ESL is reduced and decoupling solutions are enhanced.

� � � � � Simulation results for a metal core unit cell clearly reveal the advantage of using the bridged cap pad (see Figure 3). Total loop inductance decreases by 18% when hot spots of the package are assumed to be at the edge of the unit cell. If the hot spots get farther from decap, the improvement would be greater.

� � � � � No additional manufacturing process or c...