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Method for inhomogeneous dielectric poles to minimize EMI for a metal core package

IP.com Disclosure Number: IPCOM000012710D
Publication Date: 2003-May-21
Document File: 2 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for inhomogeneous dielectric poles to minimize electromagnetic interference (EMI) for a metal core package. Benefits include improved performance and improved ease of implementation.

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Method for inhomogeneous dielectric poles to minimize EMI for a metal core package

Disclosed is a method for inhomogeneous dielectric poles to minimize electromagnetic interference (EMI) for a metal core package. Benefits include improved performance and improved ease of implementation.

Background

        � � � � � When a microprocessor has a high clock frequency and requires a high power supply, the EMI radiation is an issue. It must be investigated and optimized for each design stage that includes a package. Conventional methods for package level EMI reduction include: shielding (grounding), absorption (adding electromagnetic absorbing materials), and optimalization. Shielding and absorption are high cost. Optimalization is almost pushed to its limit. Therefore, alternative approaches must meet the EMI requirement and achieve high efficiency and cost-effectiveness goals.

        � � � � � Conventionally, electromagnetic (EM) energy originates from the slots between the power and ground planes (see Figure 1).

General description

        � � � � � The disclosed method is inhomogeneous dielectric poles to minimize EMI radiation from package level due to high electromagnetic reflections. Dielectric poles are buried in build-up layers to prevent the generation of electromagnetic interference.

        � � � � � In each build-up layer, laser drill holes are created around the substrate and filled with other higher permitivity dielectric material. The minimization can be controlled by the following factors:

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