Browse Prior Art Database

Method for a memory-cooling device

IP.com Disclosure Number: IPCOM000012781D
Publication Date: 2003-May-28
Document File: 3 page(s) / 188K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a memory-cooling device. Benefits include improved thermal performance, and improved utilization of baseboard and chassis real estate.

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Method for a memory-cooling device

             

Disclosed is a method for a memory-cooling device. Benefits include improved thermal performance, and improved utilization of baseboard and chassis real estate.

 

Background

              Memory arrays are highly dense and highly powered.  They are very difficult to cool in modern computer systems. In many cases, motherboard layout dictates that the memory (DIMMs) be installed in an orientation that is perpendicular to airflow, which makes it nearly impossible to cool the memory. This invention provides an active cooling solution that concentrate air directly over the memory array in order to achieve the required cooling.

Description

              The disclosed method is a device that cools memory. The device is attached to the memory bank by its own mechanical force (see Figures 1 through 3). A forced-air unit, such as a fan, is retained by features on the disclosed method. Forced air is blown directly onto the memory banks to provide the required cooling.

              No separate screws or pins are required to keep the device assembled correctly inside the computer system.

              The disclosed method enables the memory array layout to increase in density and still achieve the required cooling. This increased memory density enables computer systems to achieve higher memory capacities than is conventionally achievable because of thermal issues. Without this mechanism, the required cooling is not possible, causing the system’s memory ban...