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Method for a BGA solder preform for the rework and assembly of BGA packages with surface mount components

IP.com Disclosure Number: IPCOM000012785D
Publication Date: 2003-May-28
Document File: 2 page(s) / 30K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a ball grid array (BGA) solder preform for the rework and assembly of BGA packages with surface-mount components. Benefits include improved yield and improved process simplification.

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Method for a BGA solder preform for the rework and assembly of BGA packages with surface mount components

Disclosed is a method for a ball grid array (BGA) solder preform for the rework and assembly of BGA packages with surface-mount components. Benefits include improved yield and improved process simplification.

Background

        � � � � � BGA solder preforms have been used conventionally as a means of quickly reworking and assembling BGA packages. However, commercially available products do not offer a means of attaching surface-mount technology (SMT) components though many BGA packages use SMT capacitors for decoupling. These decoupling capacitors are assembled directly to the BGA package, as in the case of landside capacitors (LSCs). Consequently, SMT components must be attached to BGA packages by hand soldering each individual component, which is a costly, time-consuming, and labor-intensive process. By incorporating the SMT components into a BGA solder preform, the hand assembling or reworking of SMT components to BGA packages can be avoided.

        � � � � � A requirement exists for a method of incorporating SMT components onto a BGA solder preform. Conventionally, no such product exists in the BGA package industry. Unless the BGA package is machine assembled (a process that requires significant capital investment), the SMT components must be hand soldered to the BGA package.

Description

        � � � � � The disclosed method is a BGA solder preform containing solder balls and SMT components for the assembly and rework of BGA packages (see Figure 1). The...