Browse Prior Art Database

Method for an integrated TFC

IP.com Disclosure Number: IPCOM000012798D
Publication Date: 2003-May-28
Document File: 2 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for integrating thin-film capacitor (TFC) into build up substrate package on silicon. Benefits include; improved functionality and improved performance.

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Method for an integrated TFC

Disclosed is a method for integrating thin-film capacitor (TFC) into build up substrate package on silicon. Benefits include; improved functionality and improved performance.

General description

      The disclosed method integrates a TFC into a substrate build up on silicon chip structure.

              The key elements of the method include:

•             Integration of TFC into package assembly by building the package substrate layer by layer on a silicon chip

•             TFC is sandwiched between the silicon and the build up substrate

•             No stiffener material in the substrate

•             Silicon-to-substrate connection through the predesigned structures (vias) in the TFC

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to placing the TFC on a silicon chip (Closest possible location)

•             Improved performance due to improved loop inductance (Shortest possible loop)

•             Improved cost effectiveness due to eliminating the substrate Cu stiffener

Detailed description

              The disclosed method is the integration of a TFC into package assembly. By building the package substrate layer by layer on a silicon chip. TheTFC is sandwiched between the silicon and the substrate, achieving the lowest possible loop inductance. The TFC deposition process could be metallo organic chemical vapor deposition (MOCVD) or other types. No Stiffener material is required in the substrate, which lowers the cost. The silicon-to-substrate connection is made through the predesigned structures (vias) in the TFC.

              Two options are available for implementing the disclosed method. They are designated as option A and option B. Op...