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Conforming Elastomer as a Better Thermal Interface for Heat Sink Attachment

IP.com Disclosure Number: IPCOM000012932D
Publication Date: 2003-Jun-11
Document File: 3 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to apply a liquid-type elastomer as a thermal interface material (TIM) between the electronic package surface and the heat sink base. Benefits include a good adhesion during the curing process.

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Conforming Elastomer as a Better Thermal Interface for Heat Sink Attachment

Disclosed is a method to apply a liquid-type elastomer as a thermal interface material (TIM) between the electronic package surface and the heat sink base. Benefits include a good adhesion during the curing process.

Background

The need for microprocessor power dissipation continues to increase. A heat sink solution is typically required to transfer heat from the package to the external air. The air gap between the package and the heat sink will typically form a large thermal resistance that reduces heat sink efficiency. The current state of art applies TIM to reduce the thermal resistance between the package and the heat sink. The typical TIM’s used are grease, phase-change material, gel, dry film, elastomer, epoxy, and solder alloys. The state of the art solution is shown in Figures 1 through 3.

General Description

The disclosed method is shown in Figure 4. First, a liquid-type elastomer is used instead of the traditional pre-cured (dry) elastomer. The second step places the spacers on the package edge so that a minimum thickness of elastomer is maintained after curing. The third step attaches the heat sink by clips, springs, or screws. The liquid-type of elastomer will spread out, conforming the contacting surfaces. The air gaps observed in Figure 3 are eliminated. The fourth step cures the liquid-type elastomer in the oven. During this process, a good adhesion is formed between the elastomer and...