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Method for reducing the density factor for semiconductor packaging

IP.com Disclosure Number: IPCOM000012933D
Publication Date: 2003-Jun-11
Document File: 3 page(s) / 110K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for reducing the density factor (DF) for semiconductor packaging. Benefits include improved thermal performance and improved ease of implementation.

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Method for reducing the density factor for semiconductor packaging

Disclosed is a method for reducing the density factor (DF) for semiconductor packaging. Benefits include improved thermal performance and improved ease of implementation.

Background

        � � � � � Thermal control is a primary issue for processors because excessive heat can cause device failure. Reducing the density factor prevents the occurrence of hot spots on the die and lowers the temperature.

        � � � � � Conventional packaging uses thermal interface material (TIM) and integrated heat spreaders (IHSs) to dissipate heat and improve thermal performance.

General description

        � � � � � The disclosed method facilitates the temperature reduction for die hot spots. The method includes a cooling device that combines conventional heat sink, heat pipe, and thermoelectric technologies. The evaporator area of the heat pipe is in thermal contact with the hot spots. The condenser area of the heat pipe is cooled by a thermoelectric module, which dissipates low amounts of heat at points of high temperature differences. For the die area without the hot spots, a conventional heat sink may provide adequate cooling. The disclosed method reduces the density factor, delaying the requirement for liquid cooling/refrigeration.

        � � � � � The key elements of the method include:

•        � � � � Heat pipes attached to the hot spots

•        � � � � IHS with holes to accommodate the heat pipes

•        � � � � Thermoelectric cooler attached to the heat pipe

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved thermal performance due to dissipating the raised heat levels in hot spots

•� � � � Improved ease of implementation due to not requiring modification of the die        � � � � � � � � � � �

Detailed description

        � � � � � The disclosed method provides thermoelectric cooling to lower the temperature of hot spots on the die. The device includes a combination of the conventional heat sink, heat pipes and thermoelectric technologies. The evaporator area of the heat pipe is in thermal contact with the hot spots on the die. The heat pipe condenser is cooled by a thermoelectric cooler (TEC) module that is capable of dissipating relatively low power at locations of high temperature differences. For the die area without the hot spots, a conventional heat sink may be enough for cooling. This arrangement reduces the density factor, delaying liquid cooling/refrigeration implementation.

        � � � � � A number of arrangements are possible. If there is only one hot spot or only one area on the die that would result in an operating temperature above a specified limit, then a single heat pipe and TEC could be employed. Multiple hot spots might req...