Browse Prior Art Database

Method for a metal socket frame to improve electrical and thermal performance

IP.com Disclosure Number: IPCOM000012934D
Publication Date: 2003-Jun-11
Document File: 3 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a metal socket frame to improve electrical and thermal performance. Benefits include improved functionality, improved performance, improved thermal performance, and improved design flexibility.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 54% of the total text.

Method for a metal socket frame to improve electrical and thermal performance

Disclosed is a method for a metal socket frame to improve electrical and thermal performance. Benefits include improved functionality, improved performance, improved thermal performance, and improved design flexibility.

Background

              Socket technology requires more socket pin pairs and lowered socket resistance and inductance to improve the power delivery performance and high speed signaling between the package and the motherboard. The conventional socket-N and socket-F interconnects are being replaced by Socket-T interconnects to overcome the limitations of the older technology.

              Socket-T is a highly integrated electrical and mechanical interconnect for the next generation microprocessor family. Conventional surface-mounted Socket-T interconnects are comprised of 775 metal contacts with 3 stainless steel components for load generation and structural stability. This socket provides enough headroom for additional signals and carries sufficient current. However, more reliable and efficient socket designs in terms of electrical/mechanical performance are required as the operating frequency and power/current increase and pin numbers increase.

              The conventional socket-T frame structure uses a plastic body. Power/ground/signal pins connected through this socket frame (see Figure 1).

              Lowered socket resistance and inductance are required for better power delivery performance and high speed signaling between the package and the motherboard.

General description

      The disclosed method is a socket that utilizes a metal frame. It improves overall electrical performance and provides an increased number of pins for power and signal connections. The key elements of the method include:

•             Metal socket frame used as common ground connection

•             No ground socket pins used, making more pins assigned to power and sign...